Posted: September 23, 2019 - Updated: October 1, 2019Contributing Authors: Daniel Yang, Stacy Wegner, Albert Cowsky

We are always excited to lớn see a new apple iPhone, & this year’s iPhone 11 line is no exception. This is the first ever Apple event to launch an iPhone with three rear cameras. There is also the mysterious U1 cpu which appeared on screen at the apple event, but which no one on stage made mention of. And, let’s not forget táo bị cắn dở is replacing the 7000 grade Aluminum body toàn thân with 100% recycled aluminum - a choice aimed at environmental responsibility.

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The iPhone 11 Pro Max we have in our hands is a Midnight Green model A2161 with 512 GB of storage.






Design Wins
Skyworks SKY78223-17 Front-End Module
Intel PMB5765 RF Transceiver
Intel PMB9960 Baseband Processor (likely XMM7660)
Qorvo QM81013 Envelope Tracker IC (likely)
Intel PMB6840 PMIC
STMicroelectronics ST33G1M2 MCU
Apple 338S00411 Audio Amplifier
Murata 339S00647 Wi-Fi/BT Wireless bộ combo IC
Skyworks SKY13797-19 PAM
NXP SN200 NFC&SE Module

Design Wins
Apple A13 APL1W85 PoP (A13 AP+Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM)
STMicroelectronics STB601 PMIC
Apple 338S00510 PMIC
USI Module (likely with táo bị cắn dở U1 inside)
Texas Instruments TPS61280 Battery DC/DC Converter
Apple 338S00509 Audio Codec (likely)
NXP CBTL1612A1 Display Port Multiplexer
Cypress CYPD2104: USB Type-C Port Controller
Avago AFEM-8100 Front-End Module
Skyworks SKY78221-17 Front-End Module
Apple 343S00355 / APL1092 PMIC

How much does it cost khổng lồ make an iPhone?

Here is a high-level view into the costs of the various components of the điện thoại apple iphone 11 Pro Max:


  Apple iPhone 11 Pro Max
Applications Processor$64.00
Baseband Processor$25.50
Camera / Image$73.50
Display / Touchscreen$66.50
Memory: Non-Volatile**$58.00
Memory: Volatile$11.50
Mixed Signal$1.50
Power Management / Audio$10.50
RF Component$30.00
Supporting Materials$7.50
Final Assembly và Test$21.00

Costing note: All cost estimates provided here are compiled using information available to lớn us at the time of the initial teardown. Some assumptions have been made where concrete data is not yet available. We will continue lớn gather and refine this costing data throughout our ongoing deep-dive teardown process and analysis. While we vị not expect drastic cost changes, we vày expect some adjustments. Costs in table are rounded lớn the neareast $0.50.

Apple A13 Bionic

The A13 Bionic has an táo bị cắn dở part number APL1W85. It is a Package on Package (PoP) with both the A13 Application Processor & the Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM, with the same 4GB DRAM capacity as the previous iPhone Xs Max from last year.

Update: The A13 Bionic APL1W85 has the die marks TMKF47. The die kích thước (die seal edge) is 10.67mm x 9.23mm = 98.48 mm2, representing a 18.27% die form size increase when compared khổng lồ the previous A12.

The Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM has 4 identical 1y nm die, which has already reported.


As expected, intel supplies the mobile chipsets lớn the iPhone 11. The baseband processor is intel PMB9960 which is likely the XMM7660 modem. According to lớn Intel, XMM7660 is its sixth generation LTE modem that meets the 3GPP Release 14. It supports speeds up khổng lồ 1.6 Gbps in the downlink (Cat 19) & up lớn 150 Mbps in the uplink.

As a comparison, the hãng intel PMB9955 XMM7560 modem was adopted by the điện thoại iphone Xs Max which supports up to 1 Gbps in the downlink (Cat 16) & up lớn 225 Mbps in the uplink (Cat 15). Hãng intel says the XMM7660 modem is designed with a 14 nm process node, which is the same process node as last year’s XMM7560.

This may be the last time we see the Intel điện thoại chipsets in an iPhone, since intel is officially leaving the mobile business. The change is bittersweet, as we now look forward lớn seeing the possibility of an Apple-designed modem in the future.

Either way, we expect to lớn see a Qualcomm modem in next year’s iPhone. Whether táo releases an iPhone 4G and an iPhone 5G next year is just something we will all have khổng lồ wait và see.

Power Management ICs

Intel PMB6840, táo 343S00355 (APL1092), which should be Apple’s own designed main PMIC for the A13 Bionic, táo 338S00510, Texas Instruments TPS61280 Battery DC/DC Converter, STMicroelectronics STB601, Texas Instruments SN2611A0 Battery Charger, Samsung S2DOS23 Display power Management, etc.

UWB (U1) Chip

The USI module shown below very likely contains the apple U1 chip. Táo khuyết claims that its U1 cpu uses Ultra Wideband (UWB) giải pháp công nghệ for spatial awareness, allowing iPhone 11 Pro lớn understand its precise location relative to other nearby U1-equipped táo khuyết devices.

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We are looking forward to lớn hearing more about the capabilities and use-cases táo khuyết has in mind for the U1 chip. And, with all the hype around IoT in the home, we imagine that is not the only one interested in learning more about this chip.

So far we know the unlicensed UWB in the táo bị cắn dở iPhones transmits on two different frequencies - 6.24 GHz and 8.2368 GHz. Worth mentioning: the U1 cpu can only communicate with other U1 chips. Hence, we expect khổng lồ be seeing more of the U1 in upcoming táo bị cắn products. It would be very interesting if táo managed khổng lồ get a U1 cpu into the restricted landscape of the táo bị cắn Watch Series 5.

UWB and in-room tracking is not a new concept, và has been on Apple’s agenda since before the first iPhone. Others have UWB devices, lượt thích the Estimote UWB Beacons analyzed back in January of 2018. The Beacons used DecaWave UWB transceivers for precise location of other beacons & tags. For more information on the Estimote Beacon UWB and the Estimote LTE Beacons view a listing of the different reports we have on these parts here. previously completed a Basic Floorplan Analysis of the Decawave DW1000 UWB Radio IC. The report is one of the deliverables of the IoT Connectivity SoC subscription which covers Bluetooth, Wi-Fi, ZigBee, LTE-M/NB-IoT, LoRa, Sigfox, NFC, GNSS, UWB, etc.

Wi-Fi/BT Module

Murata 339S00647. We suspect that the module would have a Broadcom Wi-Fi 6/BT 5.0 wireless full bộ IC, BCM4375? We will find out.


NXP wins the socket again with the new SN200 NFC&SE Module.

Update: We found a new die in the NXP SN200 that is different from the previous SN100 used in last year’s iPhone Xs/Xs Max/XR.

Apple 1720 Charger

We have identified 4 main IC’s in the 18 W A1720. Learn more about our findings here.

Wireless Charging

To our surprise, we found a new STMicroelectronics STPMB0 chip. We think it is very likely a wireless charging receiver IC. It also means that Broadcom has lost the socket as we have seen the Broadcom thiết kế win in the previous táo bị cắn dở iPhone.


Our investigation of iPhone 11 and iPhone 11 Pro Max’s cameras is progressing, & we have summarized a phối of findings from each in Table 1. We were excited during the September táo khuyết Special sự kiện to hear of 100% Focus Pixels for iPhone’s wide-angle camera. We expected this lớn coincide with full-chip dual photodiode phase detection autofocus (PDAF), however our initial findings show a familiar PDAF pattern comparable lớn that used for 2018 iPhone’s wide-angle camera. The analysis in progress will determine if táo has indeed gone khổng lồ dual PD as 100% Focus Pixels suggests. If true, it would be the first use of masked + dual PD PDAF we have documented.

As expected, Sony remains the vendor for the four vision cameras in iPhone 11 Pro Max. STMicroelectronics is now into year 3 of providing its global shutter IR camera chip as the detector for iPhone’s structured light based FaceID system.